This is a layout of a basic tool used to process silicon wafers into computer chips or other devices. A tool such as this would perform a single step in a recipe consisting of potentially thousands of steps to fully process a batch of wafers.

The model is scaled to use quarters as wafers, hence there is no wafer stl. 

Includes: Foup (holds 4 wafers instead of the traditional 25), Loadport, aligner, robot, chamber. The robot is also made to move around, although it cannot make full transfers. 

In this particular tool, the foup (wafer carrier) is placed on the loadport by either an operator or an automated system. It then docks and has some information read to verify it is correct. The robot picks wafers from the foup and places them into the aligner. The aligner rotates the wafers to align them correctly. Once aligned, the robot moves the wafer into the chamber for processing. After it is processed, it removes the wafer and places it back in the foup. Once all wafers are processed the foup is removed and sent onto the next tool.